Selective silicide blocking

ABSTRACT

A selectively silicided semiconductor structure and a method for fabricating same is disclosed herein. The semiconductor structure has suicide present on the polysilicon line between the N+ diffusion or N+ active area and the P+ diffusion or active area at the N+/P+ junction of the polysilicon line, and suicide is not present on the N+ active area and the P+ active area. The presence of this selective silicidation creates a beneficial low-resistance connection between the N+ region of the polysilicon line and the P+ region of the polysilicon line. The absence of silicidation on the N+ and P+ active areas, specifically on the PFET and NFET structures, prevents current leakage associated with the silicidation of devices.

BACKGROUND OF THE INVENTION

[0001] This invention relates to the fabrication of an integratedcircuit structure in which silicidation is selectively performed withinindividual integrated circuit structures to reduce current leakage.

[0002] Today, our society is heavily dependent on high-tech electronicdevices for everyday activity. Integrated circuits are the componentsthat give life to our electronic devices. Integrated circuits, includingmemory components and logic components, are found in widespread usethroughout the world, in appliances, in televisions and personalcomputers, and even in automobiles. Additionally, modern manufacturingand production facilities are becoming increasingly dependent on the useof machines controlled by integrated circuits for operational andproduction efficiencies. Indeed, in many ways, our everyday life couldnot function as it does without integrated circuits. These integratedcircuits are manufactured in huge quantities in our country and abroad.Improved integrated circuit manufacturing processes have led to drasticprice reductions and performance enhancements for these devices.Examples of performance enhancements include faster processing speedsand reduced power usage.

[0003] The traditional integrated circuit memory cell fabricationprocess begins with a wafer of silicon and involves four basicoperations: 1) layering, 2) patterning, 3) doping, and 4) heattreatment. Layering is the process of depositing materials which havedifferent conductive characteristics such as insulators or conductors inlayers on the silicon wafer until the devices are complete. These layersof material can be deposited in geometric patterns so that materialswith different conductive characteristics are stacked on top of eachother to create an operational integrated circuit in three dimensions.The patterning process used to fabricate integrated circuits istypically performed using lithography followed by a variety ofsubtractive (etch) and additive (deposition) processes. Doping can beused to create areas of P type (hole-mobile) silicon or N type(electron-mobile) silicon. Complementary metal-oxide-semiconductors(CMOS) are composed of complementary P type and N type Field EffectTransistors (PFETs and NFETS). Heat treatment can be used to activatedopants and repair damage in wafers (annealing) or to provide electricalconnections between metal layers and silicon layers (alloying). Thesefabrication methods are well known in the art.

[0004] One process regularly used in the fabrication of semiconductorstructures is silicidation. Silicidation is a process by which aconductive layer of metal-silicon alloy is formed in an integratedcircuit structure. Usually, silicidation occurs by blanketing a layer ofmetal, most commonly titanium or cobalt, across an entire wafer surfaceand heat-treating the surface to form a conductive metal-siliconcompound wherever silicon is exposed. Metal-silicon alloys such astitanium disilicide (TiSi2) or cobalt disilicide (CoSi2) can be formedat the areas of exposed silicon. Silicidation is desirable insemiconductor structures in many instances because the application ofthis conductive layer reduces the resistance in silicon active regions,especially in polysilicon lines. This reduction in resistance willreduce the amount of time that it takes for a signal to travel throughthe chip or the integrated circuit, will reduce the voltage at which achip can operate, and will improve the chip's performance.

[0005] While silicidation may reduce resistance between elements,allowing the elements to operate more effectively, this same process ofsilicidation may also exacerbate current leakage. Current leakageincreases power usage and reduces battery life. While competitive forcesdemand the improved performance associated with silicidation, those samecompetitive forces also demand reductions in power usage of integratedcircuits. Reduced power usage leads to highly desirable longer batterylife for devices such as portable computers, cellular telephones, andother portable devices.

[0006] Therefore, there exists a need to improve the performance ofintegrated circuits or chips while at the same time reducing power usageof the circuit.

BRIEF SUMMARY OF THE INVENTION

[0007] In a first aspect, the invention comprises a semiconductorstructure comprising an N+ diffusion and a P+ diffusion formed in asemiconductor substrate; a polysilicon line formed on the substrateintersecting the N+ diffusion and the P+ diffusion; wherein thepolysilicon line has a P+ region, an N+ region and an N+/P+ junctionarea therebetween; a silicide strap extending across the N+/P+ junctionarea of the polysilicon line wherein the suicide strap forms anelectrical connection between the P+ region of the polysilicon line andthe N+ region of the polysilicon line; and wherein the N+ diffusion orthe P+ diffusion are not silicided.

[0008] In a second aspect, the invention comprises a method for forminga semiconductor apparatus comprising the steps of forming an N+diffusion and a P+ diffusion; forming a polysilicon line, thepolysilicon line having a P+ region and an N+ region, the polysiliconline having an N+/P+ junction area wherein said junction area comprisesthe area where the P+ region of the polysilicon line and the N+region ofthe polysilicon line abut each other; and, selectively forming asilicide strap extending across the junction area, wherein the silicidestrap forms an electrical connection between the P+ region of thepolysilicon line and the N+ region of the polysilicon line; andselectively preventing the formation of silicide on the N+ diffusion andthe P+ diffusion.

[0009] In the invention, by selectively applying silicide at the N+/P+junction, a low resistance connection can be made between the N+ and P+regions of the polysilicon line, which increases the conductivity inthis region. By selectively not applying silicide over the NFET and PFETregions, the current leakage that occurs as a result of blanketsilicidation is minimized.

[0010] The foregoing and other features and advantages of the inventionwill be apparent from the following more particular description ofpreferred embodiments of the invention, as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0011] The embodiments of the present invention will hereinafter bedescribed in conjunction with the appended drawings, wherein likedesignations denote like elements, and

[0012]FIG. 1 is a cross-section through the gate area of a semiconductortransistor illustrating the types of leakage that can occur withsilicidation;

[0013]FIG. 2 is a flow chart illustrating an embodiment of steps in thefabrication of a semiconductor structure of the present invention;

[0014]FIG. 3 is a cross-sectional view taken at line 50 of FIG. 1, ofthe region of selective silicidation, illustrating steps in thefabrication of the present invention;

[0015]FIG. 4 is a cross-sectional view taken at line 50 of FIG. 1, ofthe region of selective silicidation, illustrating steps in thefabrication of the present invention;

[0016]FIG. 5 is a cross-sectional view taken at line 50 of FIG. 1, ofthe region of selective silicidation, illustrating steps in thefabrication of the present invention; and,

[0017]FIG. 6 is a top view of an SRAM cell illustrating the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

[0018] Best Mode for Carrying Out the Invention

[0019] This invention provides a device and method to selectively allowsilicide to form on parts of an integrated circuit structure and blocksilicide from forming on other parts of an integrated circuit structureso that the benefits of silicidation, decreased resistance betweenelements, can be achieved while reducing unwanted byproducts ofsilicidation including current leakage between elements.

[0020] Semiconductor structures can be treated or doped with chemicalsto make N type regions, electron conduction regions, or P type regions,hole conduction regions. The creation of these regions is an essentialstep in producing the complementary P type and N type field effecttransistors (PFETs and NFETs) which are components of ComplementaryMetal Oxide Semiconductor (CMOS) devices. One such CMOS device is aStatic Random Access Memory or SRAM device. While an SRAM cell is theembodiment that will be described here, those of ordinary skill in theart will recognize that the invention may be applied to anysemiconductor structure where P type polysilicon abuts N typepolysilicon.

[0021] Silicidation is a valuable and helpful process in the fabricationof semiconductor structures.

[0022] Silicidation decreases the resistance of silicon active regions,especially polysilicon lines. This reduction in resistance reduces theamount of time required for a signal to travel through the chip and alsoreduces the voltage at which a chip can operate. Also, silicidationcreates an electrical short between N type and P type regions that wouldotherwise exhibit diodic behavior. Therefore, silicidation improves theperformance of a semiconductor structure or chip.

[0023] Silicidation may also cause current leakage. This current leakagecan be a significant portion of the chip standby leakage. Turning now tothe figures, FIG. 1 illustrates several types of undesirable currentleakage that may occur as a result of silicidation. FIG. 1. is across-section across the polysilicon gate 21 of a typical NFET 20. TheNFET 20 of FIG. 1 is shown to illustrate a typical CMOS structure and isnot intended to limit the scope of the invention. FIG. 1 illustrates asilicon wafer 26 that has been patterned to define an N+ diffusion,which includes source/drain regions 22 bounded by regions of shallowtrench isolation (STI) 25. The source/drain 22 regions are spanned by apolysilicon gate 21. The polysilicon gate 21 can be a stacked gate orany other well-known gate architecture. The polysilicon gate 21 may havea layer of gate oxide 64. Spacers 24 may be present along the sides ofthe gate 21. Spacers 24 can be made from a combination of silicon oxideand/or silicon nitride which are both electrical insulators. Thesespacers 24 can be present to electrically isolate the gate from thesource/drain regions.

[0024] In a typical blanket application of silicide, the exposed face ofthe semiconductor structure is coated with metal such as titanium orcobalt and heat treated so that, in those regions where silicon isexposed, a silicide layer 23 (for example titanium disilicide (TiSi2) orcobalt disilicide (CoSi2)) is formed. In the absence of exposed silicon,no silicide is formed, and unreacted metal can be selectively removed.As illustrated in FIG. 1, silicidation may enhance current leakage in anNFET structure 20 at several locations. While FIG. 1 illustrates severalareas which may exhibit current leakage, FIG. 1 is not exhaustive of thetypes of current leakages which might occur.

[0025] Ideally, no silicide is formed on the surface of the spacers 24because the spacers 24 are composed of silicon oxide and/or siliconnitride. Therefore, when the silicidation step is performed, no silicidewill form because there is no exposed silicon present on the spacers toreact with the siliciding metal. However, after the silicidation step,some small amount of residual conducting material may be left on thespacers, resulting in some small amount of leakage between the gate andthe source or drain. This “over the spacer leakage” may be a source ofcurrent leakage in a typical device.

[0026] Gate-induced Drain Leakage (GIDL) 41 is a parasitic leakageinherent to all CMOS devices and becomes relevant for low leakagedevices where GIDL and sub-threshold source to drain current becomescomparable. GIDL 41 is current that flows between the drain and thesubstrate and is caused by an increase in the electric field under theoverlap region due to the proximity of the poly Si gate material.

[0027] In general, silicided N type FETs have higher GIDL values thannon-silicided N type FETs. This may be due to several factors. First,during the process of silicidation, silicide may spike deep into thesurface of the semiconductor structure. This spiking is referred to as asilicide defect 42. When silicide defects 42 occur over the source/drainactive silicon regions, this suicide defect 42 may result in currentleakage into the substrate (wafer) 26. Second, current leakage may alsooccur at the edge 43 of the shallow trench isolation (STI) 25 where itmeets the silicon wafer 26. In theory, the surface of the silicon activearea or source/drain area 22 and the surface of the adjacent STI 25 isperfectly flat. However, in practice, there may be a depression at thislocation or the STI 25 may be weak at this abutment. During the processof silicidation, silicide can pool in this depression, or cause“pull-down” as illustrated in FIG. 1. This effect may cause currentleakage to the silicon substrate 26.

[0028] In addition, in theory, a perfectly even and uniform layer ofmetals can be applied to the surface of a semiconductor device to form aperfect uniform layer of silicide. In practice, it can be very difficultto form a perfectly uniform layer of silicide. Silicide may not formevenly in very small active areas of silicon and/or in small activeareas of silicon between polysilicon lines called “canyons.” This poorsilicide formation may lead to leakage similar to those described above.In addition, this poor silicide formation may lead to other defects thatcause the semiconductor to exhibit poor performance or cause circuits tofail.

[0029]FIG. 2 is a flow chart illustrating an embodiment of steps in thefabrication of a semiconductor structure which is selectively silicidedto allow silicide to form on parts of an integrated circuit structureand block silicide from forming on other parts of an integrated circuitstructure of the present invention. In Step 1, a semiconductor structureof the present invention is fabricated from a prepared silicon wafer 26.Active regions are defined and trenches are etched in the silicon aroundthe active regions. Isolation material (STI) is deposited into thetrenches to isolate active areas. In Step 2, gates are prepared bydepositing gate oxide in the region of the gate and depositing gatepolysilicon. Turning now to FIG. 3, a cross-sectional view at line 50 ofFIG. 1, of an example of a semiconductor structure which might resultfrom steps 1 and 2 of FIG. 2 is illustrated. FIG. 3 illustrates thatthis gate polysilicon can be in the form of a long polysilicon line 54.

[0030] Turning back to FIG. 2, in step 3, N+ and P+ active areas areimplanted to form N+ diffusions (see 66 in FIG. 6) by implanting ordoping the exposed silicon in these regions with an N type element suchas Arsenic or other suitable element. Similarly, P+ diffusions areformed (see 67 in FIG. 6) by implanting or doping the exposed silicon inthese regions with a P type element such as Boron or other suitableelement. These N+ diffusions and P+ diffusions, when present in theappropriate architecture on either side of the polysilicon gate, formsource/drain regions in NFETs and PFETs. During the implanting step,gate polysilicon, shown in FIG. 3 as long polysilicon lines 54, are alsoimplanted. This creates a polysilicon line 54 with an N+ region 68 and aP+ region 69. At a location along the polysilicon line 54, the N+ regionabuts the P+ region to form an N+/P+ junction 70. Examples of thesestructures are illustrated in FIGS. 3-5.

[0031] In Step 4, a blocking layer 80 is selectively applied to theactive areas (the regions shown as 82 and 83 in FIG. 6). This blockinglayer may be patterned or selectively applied to the active areas byusing a mask to limit the application of the blocking layer to theactive areas, or by applying a blanket layer of blocking material andselectively removing the blocking material from the application areas.the blocking material may be nitride or other suitable blockingmaterial. An example of this blocking layer 80 is illustrated in FIG. 4.

[0032] In Step 5, a blocking layer can be applied to selectively exposethe N+/P+ junction for silicidation. For example, a layer of blockingmaterial such as nitride can be applied to the entire surface of thesemiconductor structure. A layer of photoresist can be applied on top ofthe nitride hard mask material. The photoresist can be selectivelyexposed or patterned using a mask. The mask selectively exposes thephotoresist to light. Therefore, some areas of photoresist are exposedto light and some areas are in shadow during the light exposure. Theexposed photoresist is then developed. Depending on whether a negativeor positive tone resist is used, the unexposed or exposed photoresistcan then be washed away during rinsing steps. After this patterningstep, the semiconductor structure has a layer of nitride or hard mask,covered with a selectively applied layer of photoresist. A “Reactive IonEtch” (RIE) may be used to etch the areas not protected by photoresist.After the RIE step, the semiconductor structure may have a layer ofnitride or hard mask, patterned to expose the polysilicon in the regionof the N+/P+ junction. An example of this structure is illustrated inFIG. 4.

[0033] Alternatively, a layer of photoresist can be applied to thesurface of the semiconductor structure. A mask can be used toselectively expose photoresist to form a pattern of photoresist on thearea of the N+/P+ junction 70 of the polysilicon gate. A layer ofnitride or other blocking material can be applied to the semiconductorstructure, creating a semiconductor structure with nitride or otherblocking material present on top of the active areas, and photoresistpresent on top of the N+/P+ junction 70 of the polysilicon gate. Thephotoresist can then be removed using techniques well-known in theindustry. As a result of these steps, a layer of blocking material, orhard mask 80, resides over the active areas of the semiconductorstructure and the silicon of the N+/P+ junction region of thepolysilicon gate is exposed.

[0034] As will be recognized by those of ordinary skill in the art, manyalternative methods can be used to fabricate the structure as shown inFIG. 5. While we have described two such methodologies, these methodsare not exhaustive of the methods that can be used to fabricate such astructure.

[0035] In Step 6, metal such as cobalt or titanium or other suitablemetal is applied to the surface of the semiconductor structure and thesemiconductor structure is heat-treated to form metal silicide in thearea of exposed silicon. In the areas covered with the blocking layer,no silicide is formed. This silicide structure is a silicide strap 75.An example of this structure is illustrated in FIG. 5.

[0036] In Step 7, the semiconductor structure is finished. Thesefinishing steps will depend on the requirements of the device and mayinclude applying a blanket dielectric such as nitride, completingdevices, creating contacts and metal wiring and other back end of lineprocessing. The nature of the finishing steps is dependent upon thenature of the semiconductor device that is being fabricated.

[0037] FIGS. 3-5 are cross-sectional views taken at line 50 of FIG. 1(see also line 50 of FIG. 6, also indicating the cross-sectional viewrepresented by FIGS. 3-5), of the region of selective silicidation, thesilicide strap, illustrating steps in the fabrication of the presentinvention. FIG. 3 illustrates the semiconductor structure after thesubstrate has been prepared, STI 25 has been applied to isolate NFET andPFET active areas, gate oxide 64 has been deposited and polysiliconlines 54 have been deposited. In addition, source/drain regions (notshown in FIGS. 3-5 but see 66 and 67 in FIG. 6) and polysilicon lines 54have been implanted to form P+ diffusions (see 67 in FIG. 6) andN+diffusions (see 66 in FIG. 6). The N+ diffusion is part of at leastone NFET (see 66 in FIG. 6) and the P+ diffusion is part of at least onePFET (see 67 in FIG. 6). Also shown in FIG. 3 is the N+/P+ junction area70.

[0038] As may be recognized by those of ordinary skill in the art, theN+/P+ junction 70 may form a semiconductor diode. However, theapplication of suicide across this N+/P+ junction 70 creates alow-resistance electrical connection. In an SRAM cell 60 as illustratedin FIG. 6, a low-resistance electrical connection may be more desirablethan a diode device.

[0039] Once these steps are complete, (steps 1-3 of FIG. 2), selectivesilicidation may occur. As discussed above, a hard mask 80 may beapplied to the top surface of the semiconductor structure, but isblocked from the region of the N+/P+ junction 70 (Steps 4 and 5 of FIG.2). This step is illustrated in FIG. 4.

[0040] Finally, as illustrated in FIG. 5, cobalt, titanium or othersiliciding metal can be applied to the surface of the semiconductorstructure and heat treated (Step 6 of FIG. 2). This heat-treatmentcreates metal-silicide in areas where the silicided metal was applied toexposed silicon. Therefore, a silicide strap 75 is created in the areaof the polysilicon line 54 which was not blocked by the blocking layer80. In regions protected by the hard mask 80, or by a layer of nitride,oxide, or other blocking material, no silicidation will take place andresidual siliciding metal can be selectively removed.

[0041]FIG. 6 is a top view of an SRAM cell 60 of the present invention.This SRAM cell 60 is well-known SRAM architecture. While an SRAM cell 60is illustrated here, those of ordinary skill in the art will recognizethat this invention is applicable in any semiconductor structure whichutilizes both NFETs and PFETs. The SRAM cell 60 illustrated in FIG. 6illustrates an embodiment of the silicide strap 75 of the presentinvention.

[0042]FIG. 6 illustrates structures that have been created on thesilicon substrate to create the SRAM 60 semiconductor structure. Line 50in FIG. 6 corresponds to line 50 in FIG. 1, and illustrates the crosssection illustrated in FIGS. 3-5. A P+ active area 77 and an N+ activearea 76 have been defined by isolating active regions using STIprocessing. The P+ active area 77 includes two PFETs 67. The N+ activearea 76 includes four NFETs 66. Long polysilicon lines 54 have beendeposited to create gate structure for both PFETs 67 and NFETs 66. Longpolysilicon lines 54 have been formed intersecting the P+ active area77, forming PFETs 67, and the N+ active area, forming two of the NFETs66. Long polysilicon lines 54 also intersect the P+ diffusions 67 to theN+ diffusions 66. The N+ active area 76 and the P+ active area 77 aredoped. Because this doping step occurs after the polysilicon line 54 hasbeen applied, the polysilicon line 54 is also doped N+ in the N+ area 71where it overlaps the N+ diffusion 76 and P+ in the P+ area 72 where itoverlaps the P+ diffusion 77. This doping will create an N+/P+ junction70, an area of the polysilicon line where the N+ doped region 71interacts with the P+ doped region 72, or where the N+ doped region 71of the polysilicon line abuts the P+ doped region 72 of the polysiliconline.

[0043] Blocking, as discussed in FIGS. 2-5, can be applied as indicatedby regions 82 and 83. As discussed and illustrated in FIGS. 2 and 4,blocking material such as nitride can be applied to block the formationof silicide on these regions. As FIG. 6 illustrates, silicidation can beselectively applied to the region that has not been protected by theapplication of the blocking agent. Silicide can be selectively appliedto the regions outside the blocked regions represented by 82 and 83.Because only the polysilicon lines 54 are exposed silicon, in the regionoutside block boxes 82 and 83 (the surrounding regions may be isolationmaterial or STI), only the polysilicon lines 54 that are not in theblocked regions 82 and 83 become silicided upon the application of asiliciding metal and heat treatment. In this manner, the silicide strap75 is achieved only in the region of the polysilicon lines 54 which isnot protected by a blocking agent. The silicide strap 75 is the lowresistance connection along the polysilicon line 54 at the N+/P+junction 70 created by selective silicidation. In addition, becausethese regions are blocked (see 82 and 83), this selective silicidationdoes not create a layer of silicide across the PFETs 67 and NFETs 66,which, if present, could lead to the types of current leakage as shownin FIG. 1.

[0044] When a device, such as the SRAM structure of FIG. 6, has beenselectively silicided according to an embodiment of the presentinvention, silicide only resides on a silicide strap 75 which creates alow resistance connection at the N+/P+ junction 70. This low resistanceconnection enhances the performance of the semiconductor device. Inaddition, according to an embodiment of the present invention, silicidedoes not reside over the active areas 76 and 77 including thesource/drain regions of semiconductor devices.

[0045] Because silicide is not present except at the N+/P+ junction 70,leakages such as those illustrated in FIG. 1 are reduced. Because thereis no silicide present on the spacers 24 along the sides of the gate 21,there is no “over the spacer leakage” between the gate and thesource/drain caused by silicide formation (See FIG. 1).Silicide-mediated GIDL will also be absent in devices that are notsilicided. Silicide cannot spike over the source/drain region to createcurrent leakage from the source/drain region into the substrate becauseno suicide is present over the source/drain region. And, no suicide ispresent at the edge of the STI, so no silicide pooling or suicide“pull-down” can occur, causing current leakage. These and otherreductions in current leakage may lead to greater efficiency and lesspower usage in the semiconductor device. Therefore, selectivelysilicided semiconductor structures, such as the SRAM cell described inFIG. 6, may use less power than semiconductor structures which do notmake use of an embodiment of the present invention.

[0046] While the invention has been particularly shown and describedwith reference to embodiments thereof, it will be understood by thoseskilled in the art that various changes in form and details may be madetherein without departing from the spirit and scope of the invention.

What is claimed is:
 1. A semiconductor structure comprising: an N+diffusion and a P+ diffusion formed in a semiconductor substrate; apolysilicon line formed on the substrate intersecting the N+ diffusionand the P+ diffusion; wherein the polysilicon line has a P+ region, anN+ region and an N+/P+ junction area therebetween; a suicide strapextending across the N+/P+ junction area of the polysilicon line whereinthe silicide strap forms an electrical connection between the P+ regionof the polysilicon line and the N+ region of the polysilicon line; andwherein the N+ diffusion or the P+ diffusion are not silicided.
 2. Thesemiconductor structure of claim 1, wherein the N+ diffusion is part ofat least one NFET and wherein the P+ diffusion is part of at least onePFET.
 3. The semiconductor structure of claim 1, wherein thesemiconductor structure is part of an SRAM cell.
 4. The semiconductorstructure of claim 1, wherein the polysilicon line comprises at leastone gate.
 5. The semiconductor structure of claim 1 wherein currentleakage in the semiconductor structure is reduced by preventing silicideformation on the N+ diffusion and the P+ diffusion.
 6. The method ofclaim 5 wherein the current leakage reduced comprises Gate Induced DrainLeakage (GIDL).
 7. A semiconductor device comprising: a first PFET, thefirst PFET including a source diffusion and a drain diffusion; a firstNFET, the first NFET including a source diffusion and a drain diffusion;a first polysilicon line connecting the first NFET to the first PFET,the first polysilicon line including a N+ portion, a P+ portion and aN+/P+ junction area; and a silicide strap extending across the N+/P+junction area of the first polysilicon line wherein the silicide strapforms an electrical connection between the P+ portion and the N+ portionof the first polysilicon line, and wherein the silicide strap is notformed on the PFET source diffusion and PFET drain diffusion and whereinthe silicide strap is not formed on the NFET source diffusion and NFETdrain diffusion.
 8. The semiconductor device of claim 7 furthercomprising: a second PFET, the second PFET including a source diffusionand a drain diffusion; a second NFET, the second NFET including a sourcediffusion and a drain diffusion; a second polysilicon line connectingthe second NFET to the second PFET, the second polysilicon lineincluding a N+ portion, a P+ portion and a N+/P+ junction area; and asecond silicide strap extending across the N+/P+ junction area of thesecond polysilicon line wherein the silicide strap forms an electricalconnection between the P+ portion and the N+ portion of the secondpolysilicon line, and wherein the second silicide strap is not formed onthe PFET source diffusion and PFET drain diffusion and wherein thesecond silicide strap is not formed on the NFET source diffusion andNFET drain diffusion.
 9. The semiconductor device of claim 7 wherein thefirst PFET and the first NFET are portions of an SRAM device.
 10. Thesemiconductor device of claim 7, wherein the first polysilicon linecomprises a gate of the first PFET and the first NFET.
 11. Thesemiconductor device of claim 8, wherein the second PFET and the secondNFET are portions of an SRAM device.
 12. The semiconductor device ofclaim 8, wherein the second polysilicon line comprises a gate of thesecond PFET and the second NFET.
 13. The semiconductor structure ofclaim 7 wherein current leakage is reduced by preventing silicideformation on the PFET source diffusion and PFET drain diffusion and theNFET source diffusion and NFET drain diffusion.
 14. The semiconductorstructure of claim 13 wherein the current leakage reduced comprises GateInduced Drain Leakage (GIDL).
 15. The semiconductor structure of claim 8wherein current leakage is reduced by preventing silicide formation onthe PFET source diffusion and PFET drain diffusion and the NFET sourcediffusion and NFET drain diffusion.
 16. The semiconductor structure ofclaim 15 wherein the current leakage reduced comprises Gate InducedDrain Leakage (GIDL).
 17. A method for forming a semiconductor apparatuscomprising the steps of: forming an N+ diffusion and a P+ diffusion;forming a polysilicon line, the polysilicon line having a P+ region andan N+ region, the polysilicon line having an N+/P+ junction area whereinsaid junction area comprises the area where the P+ region of thepolysilicon line and the N+ region of the polysilicon line abut eachother; and, selectively forming a silicide strap extending across thejunction area, wherein the silicide strap forms an electrical connectionbetween the P+ region of the polysilicon line and the N+ region of thepolysilicon line; and selectively preventing the formation of silicideon the N+ diffusion and the P+ diffusion.
 18. The method of claim 17wherein the step of selectively forming a silicide strap comprises:forming a hard mask on the semiconductor structure; patterning the hardmask to expose the N+/P+ junction area; and forming silicide in theexposed N+/P+ junction area.
 19. The method of claim 17 wherein the stepof selectively preventing the formation of silicide on the N+ diffusionand the P+ diffusion comprises: forming a hard mask on the semiconductorstructure; and patterning the hard mask to expose portions of thesemiconductor structure, said patterning not exposing the N+ diffusionand the P+ diffusion.
 20. The method of claim 17 further comprising thestep of: completing devices and back end of line processes.
 21. Themethod of claim 17 wherein the semiconductor structure is part of anSRAM.
 22. The method of claim 17 wherein current leakage is reduced byselectively preventing silicide formation on the N+ diffusion and P+diffusion.
 23. The method of claim 22 wherein the current leakagereduced comprises Gate Induced Drain Leakage (GIDL).